ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,532, issued on Jan. 20, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Epitaxial features in semicondu... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,527,792, issued on Jan. 20, was assigned to SUN PHARMA ADVANCED RESEARCH COMPANY LTD. (Mumbai, India). "Stable multiparticulate pharmaceutical ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,967, issued on Jan. 20, was assigned to Michael Stapleton Associates Ltd. (New York). "Canine inspection recording" was invented by Marc We... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. D1,109,515, issued on Jan. 20, was assigned to NIKE Inc. (Beaverton, Ore.). "Shoe" was invented by Tom Ceurvels (Portland, Ore.), Jordyn N. Klumpp... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,102, issued on Jan. 20, was assigned to The Trustees of Columbia University in the City of New York (New York). "Systems, methods, and comp... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,112, issued on Jan. 20, was assigned to Arizona Board of Regents on behalf of Arizona State University (Scottsdale, Ariz.) and Mayo Foundati... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,287, issued on Jan. 20, was assigned to NOKIA TECHNOLOGIES OY (Espoo, Finland). "Updating positioning assistance configuration" was invente... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,555, issued on Jan. 20, was assigned to Infineon Technologies Canada Inc. (Ottawa). "Desaturation protection of power field-effect transist... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,529,426, issued on Jan. 20, was assigned to FISHER CONTROLS INTERNATIONAL LLC (Marshalltown, Iowa). "Coupling assemblies for rotary valves and ... Read More
ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,715, issued on Jan. 20, was assigned to DISCO Corp. (Tokyo). "Processing method of bonded wafer" was invented by Hayato Iga (Tokyo) and Kaz... Read More